Description
Key Features of the LAM 9600:
- Plasma Etch System: It uses a plasma-based process to selectively remove materials from the wafer surface, such as silicon, oxide, or nitride, with high precision.
- Standalone Tool: This means that it operates independently, as a single piece of equipment, rather than being integrated into a cluster tool configuration. It is dedicated to a specific process step, like etching, without combining other processes like deposition or cleaning within the same physical enclosure.
- Versatility: The LAM 9600 series supports multiple process chambers and recipes, allowing users to perform various etching steps for different materials and applications.
- Critical in Semiconductor Manufacturing: The tool is used to create fine patterns on silicon wafers, which is essential in defining transistor gates, interconnects, and other critical structures in ICs.
In summary, the LAM 9600 standalone tool is a robust plasma etching machine used for precise material removal in the production of semiconductor devices.
Download the 9600 Config Sheet here: 9600 Config Sheet
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